Requirements
The Requirement Design Concepts Design Features Assembly & Test ResultsThe Requirement
To design and manufacture a precision embossing mechanism for the MEMS industry to interface with an existing wafer bonding platform
Specification
- Stroke: ó 1mm
- Position repeatability & resolution: < 1µm
- Lateral error: < 1µm
- Embossing forces: < 15kN
- Vacuum compatible
