Home » Case Studies

Requirements

The Requirement Design Concepts Design Features Assembly & Test Results

The Requirement

To design and manufacture a precision embossing mechanism for the MEMS industry to interface with an existing wafer bonding platform

Specification

  • Stroke: ó 1mm
  • Position repeatability & resolution: < 1µm
  • Lateral error: < 1µm
  • Embossing forces: < 15kN
  • Vacuum compatible
Precision Embossing Mechanism
Precision Embossing Mechanism